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Global SMT & Packaging

Soldering and profiling discussion panel at APEX 2009

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About this episode

Mike Buetow of Circuits Assembly magazine moderates a discussion panel on soldering and thermal profiling at APEX 2009. Panelists include Keith Howe...

Mike Buetow of Circuits Assembly magazine moderates a discussion panel on soldering and thermal profiling at APEX 2009. Panelists include Keith Howell of Nihon Superior, Fred Dimock of BTU and Michael Limberg from KIC. Less

Apr 7, 2009 33:46

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Global SMT & Packaging

Soldering and profiling discussion panel at APEX 2009

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